Nidec Advance Technology to Showcase Cutting-Edge Solutions at SEMICON Southeast Asia 2025
Nidec Advance Technology Corporation has confirmed its participation in the upcoming SEMICON Southeast Asia 2025, scheduled for May 20-22 at the Sands Expo and Convention Centre in Singapore. The event marks a premier opportunity for the Company to unveil its latest innovations tailored for the semiconductor industry.
Among the highlights of Nidec Advance Technology’s exhibition will be its advanced optical 2D/3D inspection equipment, including the RWi300MK series specifically designed for semiconductor wafers. The Company will also showcase its GATS series for conduction and short-circuit inspections of semiconductor packages, a large substrate electrical inspection system for AI servers, and the R-700 series AC/DC multi-tester. Additionally, visitors can expect precision tools such as pin probes for ultra-high-precision inspections and specialized semiconductor wafer probe cards.
In a notable expansion of its offerings, Nidec Advance Technology will introduce new probing solutions aimed at the burgeoning power semiconductor segment, which plays a critical role in industries such as electric vehicles (EV), cloud computing, and renewable energy. The new Chamber Head and Thermocoupling technologies are designed to meet the stringent testing needs of these high-demand applications.
Attendees are encouraged to visit Nidec Advance Technology at Booth #L2421 on Level 1 to explore how the Company’s innovative solutions can significantly enhance quality and efficiency throughout the semiconductor value chain.
For more information about SEMICON Southeast Asia 2025, visit the official website at SEMICON SEA. Nidec Advance Technology looks forward to engaging with industry professionals and demonstrating its commitment to advancing semiconductor testing and inspection solutions.
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